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industrial and multi-market data sheet revision 0.9, 2010-10-14 preliminary ESD3V3U4ULC ultra low capacitance esd array ESD3V3U4ULC tvs diodes transient voltage suppressor diodes
edition 2010-10-14 published by infineon technologies ag 81726 munich, germany ? 2010 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
ESD3V3U4ULC preliminary data sheet 3 revision 0.9, 2010-10-14 trademarks of infineon technologies ag aurix?, bluemoon?, comneon?, c166?, crossave?, canpak?, cipos?, coolmos?, coolset?, corecontrol?, dave?, easypim?, econobridge?, econodual?, econopack?, econopim?, eicedriver?, eupec?, fcos?, hitfet?, hybridpack?, isoface?, i2rf?, isopack?, mipaq?, modstack?, my-d?, novalithic?, omnitune?, optimos?, origa?, profet?, pro-sil?, primarion?, primepack?, rasic?, reversave?, satric?, sieget?, sindrion?, smarti?, smartlewis?, tempfet?, thinq!?, tricor e?, trenchstop?, x-gold?, xmm?, x-pmu?, xposys?. other trademarks advance design system? (ads) of agilent technologies, amba?, arm?, multi-ice?, primecell?, realview?, thumb? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus?, firstgps? of trimble navigation ltd. emv? of emvco, llc (visa holdings inc.). epcos? of epcos ag. flexgo? of microsoft corporation. flexray? is licensed by flexray consortium. hyperterminal? of hilgraeve incorporated. iec? of commission electrotechnique internationale. irda? of infrared data association corporation. iso? of international organization for standardization. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. microtec?, nucleus? of mentor graphics corporation. mifare? of nxp. mipi? of mipi alliance, inc. mips? of mips technologies, inc., usa. murata? of murata manufacturing co., microwave office? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. openwave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of sirius sattelite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of symbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. tektronix? of tektronix inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilog?, palladium? of cadence design systems, inc. vlynq? of texas instruments incorporated. vxworks?, wind river? of wind river systems, inc. zetex? of diodes zetex limited. last trademarks update 2010-06-09 revision history page or item subjects (major changes since previous revision) revision 0.9, 2010-10-14
ESD3V3U4ULC table of contents preliminary data sheet 4 revision 0.9, 2010-10-14 table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 list of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 list of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 ultra low capacitance esd array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.2 application examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 product description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 electrical characteristics at t a = 25 c, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2 typical performance characteristics at t a = 25 c, unless otherwise specified . . . . . . . . . . . . . . . . 10 4 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.1 pg-tslp-9-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 references . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table of contents
ESD3V3U4ULC list of figures preliminary data sheet 5 revision 0.9, 2010-10-14 figure 1 a) pin configuration and b) schematic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 2 definitions of electrical characteristics [1] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 3 line capacitance c l = f ( v r ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 4 reverse current i r = f ( t a ), v r = 3.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 5 forward characteristic, i f = f ( v f ), current forced . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 6 reverse characteristic, i r = ( v r ), voltage forced . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 7 reverse tlp characteristic note: [2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 8 forward tlp characteristic note: [2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 9 usb3.0 structure with esd protection devices [3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 10 ordering information scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 11 pg-tslp-9-1: package overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 12 pg-tslp-9-1: footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 13 pg-tslp-9-1: packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 14 pg-tslp-9-1: marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 list of figures
ESD3V3U4ULC list of tables preliminary data sheet 6 revision 0.9, 2010-10-14 table 1 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 2 maximum rating at t a = 25 c, unless otherwise specified. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 3 dc characteristics at t a = 25 c, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 4 rf characteristics at t a = 25 c, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 5 esd characteristics at t a = 25 c, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 list of tables
ESD3V3U4ULC ultra low capacitance esd array preliminary data sheet 7 revision 0.9, 2010-10-14 1 ultra low capacitance esd array 1.1 features ? esd / transient protection of high speed data lines exceeding : ? iec61000-4-2 (esd) : 20 kv (air/contact) ? iec61000-4-4 (eft) : 2.5 kv (5/50ns) ? iec61000-4-5 (surge) : 3 a (8/20ns) ? maximum working voltage: v rwm = 3.3 v ? very low reverse current: i r = 1 na (typical) ? extremely low capacitance c l = 0.4 pf i/o to gnd (typical) ? very low reverse clamping voltage: v cl = 9 v at i pp = 16 a (typical) ? very low forward clamping voltage: v fc = 6 v at i pp = 16 a (typical) ? very low reverse dynamic resistance: r dyn,rev = 0.2 ? (typical) ? tslp-9-1 package with pad pitch 0.5 mm ? optimized pad design to simplify pcb layout ? pb-free and halogen-free package (rohs compliant) 1.2 application examples ? usb 3.0, 10/100/1000 ethernet, firewire ? dvi, hdmi, s-ata, displayport, mobile communication, lcd displays, camera ? consumer products (stb, mp3, dvd, dsc, ...) notebooks and desktop computers, peripherals 2 product description figure 1 a) pin configuration and b) schematic diagram table 1 ordering information type package configuration marking code ESD3V3U4ULC pg-tslp-9-1 4 lines, uni-directional z2 b) schematic diagram a) pin configuration pin 1 pin 2 pin 4 pin 5 pin 3 pin 9 pin 8 pin 7 pin 6 pin 1 pin 2 pin 4 pin 5 pin 3 i/o i/o i/o i/o gnd
ESD3V3U4ULC characteristics preliminary data sheet 8 revision 0.9, 2010-10-14 3 characteristics 3.1 electrical characteristics at t a = 25 c, unless otherwise specified figure 2 definitions of electrical characteristics [1] table 2 maximum rating at t a = 25 c, unless otherwise specified parameter symbol values unit min. typ. max. esd contact discharge 1) 1) v esd according to iec61000-4-2 v esd -20 ? 20 kv peak pulse current ( t p = 8/20 s) 2) 2) i pp according to iec61000-4-5 i pp -3?3a operating temperature t op -40 ? 125 c storage temperage t stg -65 ? 150 c table 3 dc characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. reverse working voltage v rwm ? ? 3.3 v i/o to gnd reverse current i r ?150na v r = 3.3 v, i/o to gnd diode _characteristic_curve_with_snapback.vsd v f forward voltage i f forward current v r reverse voltage i r reverse current i rwm v rwm r diff, rev v fc v trig i trig i pp i r i f v f v r i hold v hold r diff, fwd v f v r r diff, rev differential reverse series resistance r diff , fwd differential forward series resistance v trig triggering reverse voltage v hold holding reverse voltage v rwm reverse working voltage maximum v fc forward clamping voltage i trig triggering reverse current i hold holding reverse current i rwm reverse working current maximum -i pp v cl i pp peak pulse current v cl clamping voltage
ESD3V3U4ULC characteristics preliminary data sheet 9 revision 0.9, 2010-10-14 table 4 rf characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. line capacitance c l ? 0.4 0.65 pf v r = 0 v, f = 1 mhz, i/o to gnd ? 0.2 0.35 pf v r = 0v, f = 1 mhz, i/o to i/o table 5 esd characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. reverse clamping voltage 1) [2] 1) please refer to application note an210. tlp parameter: z 0 = 50 , t p = 100ns, t r = 300ps, averaging window: t 1 = 30 ns to t 2 = 60 ns, extraction of dynamic resistance using least squares fit of tlp charactertistic between i pp1 = 10 a and i pp2 =40a. v cl ?9?v i pp = 16 a ?12?v i pp = 30 a forward clamping voltage 1) [2] v fc ?6?v i pp = 16 a ?10?v i pp = 30 a reverse dynamic resistance 1) [2] r dyn, rev ?0.2? forward dynamic resistance 1) [2] r dyn, fwd ?0.25?
ESD3V3U4ULC characteristics preliminary data sheet 10 revision 0.9, 2010-10-14 3.2 typical performance characteristics at t a = 25 c, unless otherwise specified figure 3 line capacitance c l = f ( v r ) figure 4 reverse current i r = f ( t a ), v r = 3.3 v 0 0.5 1 1.5 0 1 2 3 c l (pf) v r (v) 10 -10 10 -9 10 -8 10 -7 10 -6 -50 -25 0 25 50 75 100 125 150 i r (a) t a ( c)
ESD3V3U4ULC characteristics preliminary data sheet 11 revision 0.9, 2010-10-14 figure 5 forward characteristic, i f = f ( v f ), current forced figure 6 reverse characteristic, i r = ( v r ), voltage forced 10 -8 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 0.3 0.4 0.5 0.6 0.7 0.8 0.9 i f (a) v f (v) 10 -12 10 -11 10 -10 10 -9 10 -8 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 0 1 2 3 4 5 6 7 i r (a) v r (v)
ESD3V3U4ULC characteristics preliminary data sheet 12 revision 0.9, 2010-10-14 figure 7 reverse tlp characteristic note: [2] figure 8 forward tlp characteristic note: [2] note: tlp parameter: z 0 = 50 , t p = 100 ns, t r = 300 ps, averaging window: t 1 = 30 ns to t 2 = 60 ns, extraction of dynamic resistance using least squares fit of tlp charactertistic between i pp1 = 10 a and i pp2 = 40 a. the equivalent stress level v iec according iec 61000-4-2 ( r = 330 , c = 150 pf) is calculated at the broad peak of the iec waveform at t = 30 ns with 2 a / kv 0 10 20 30 40 50 60 70 0 5 10 15 20 25 0 5 10 15 20 25 30 35 tlp current (a) equivalent v iec [kv] tlp voltage (v) ESD3V3U4ULC r dyn r dyn =0.2 -70 -60 -50 -40 -30 -20 -10 0 -25 -20 -15 -10 -5 0 -35 -30 -25 -20 -15 -10 -5 0 tlp current (a) equivalent v iec [kv] tlp voltage (v) ESD3V3U4ULC r dyn r dyn =0.25
ESD3V3U4ULC application information preliminary data sheet 13 revision 0.9, 2010-10-14 4 application information to design usb3.0 link for best system level esd performance and error free signal integrity is mandatory. to bring both requirements together, the esd protection devices has to provide excellent esd and a very low device capacitance. the infineon ESD3V3U4ULC in ?array? configuration, combined with a clear and straight forward ?full through? layout fulfills these requirements in the best way. figure 9 usb3.0 structure with esd protection devices [3] tx+ tx- + - rx+ + - rx+ rx- + - tx+ tx- + - usb3.0 cable ss transmission channel usb3.0: ss-hub e.g. pc superspeed data in superspeed data in superspeed data out superspeed data out tx- tx+ tx- tx+ rx- rx+ rx- rx+ mated connector mated connector usb3.0: ss-device e.g. storage tvs esd diodes rx- tvs esd diodes
ESD3V3U4ULC ordering information scheme preliminary data sheet 14 revision 0.9, 2010-10-14 5 ordering information scheme figure 10 ordering information scheme esd 5v3 u - xx yy package or application xx = pin number (i.e.: 02 = 2 pins; 03 = 3 pins) yy = package family: ls = tsslp lrh = tslp s = sot363 u = sc74 xx = application family: lc = low clamp hdmi u ni- / b i-directional or r ail to r ail protection maximum working voltage v rwm in v: (i.e.: 5v3 = 5.3v) esd 0p1 rf - xx yy package xx = pin number (i.e.: 02 = 2 pins; 03 = 3 pins) yy = package family: ls = tsslp lrh = tslp for r adio f requency applications line capacitance c l in pf: (i.e.: 0p1 = 0.1pf) n u n umber of protected lines (i.e.: 1 = 1 line; 4 = 4 lines) capacitance: s tandard (>10pf), l ow (<10pf), u ltra-low (<1pf)
ESD3V3U4ULC package information preliminary data sheet 15 revision 0.9, 2010-10-14 6 package information 6.1 pg-tslp-9-1 figure 11 pg-tslp-9-1: package overview figure 12 pg-tslp-9-1: footprint figure 13 pg-tslp-9-1: packing figure 14 pg-tslp-9-1: marking tslp- 9 -1-po v02 top view 9 1 56 pin 1 marking 0.5 9 0.035 1 0. 9 4 0.025 1) 2.3 0.035 0.31 0.05 max. +0.01 -0.02 1) dimension applies to plated terminals 4 8 x 0.2 0.025 1) (0.03) (0.05) 0.4 0.025 1) 0.025 8 x 0.35 1) 2 3 7 8 0.5 4 x 0.5 = 2 0.05 b a 0.05 b a 0.05 b a 0.05 b a a b bottom view stencil apertures copper solder mask tslp-9-1-fp v01 0.38 0.38 0.24 1 2.3 0.2 0.2 0.3 0.3 0.2 0.3 0.3 0.2 0.3 0.2 0.38 0.38 0.24 1 2.3 0.2 0.2 0.3 0.3 0.2 0.3 0.3 0.3 1.6 4 8 2.3 0.5 pin 1 marking tslp-9-1-tp v03 tslp-9-1-mk v02 pin 1 marking 1234567 type code data code (yyww)
ESD3V3U4ULC references preliminary data sheet 16 revision 0.9, 2010-10-14 references [1] on-chip esd protection for integrated circuits , albert z. h. wang, isbn:0-7923-7647-1 [2] infineon technologie ag - application note an210 : effective esd protection design at system level using vf-tlp characterization methodology [3] infineon technologie ag - application note an240 : effective esd protection for usb3.0, combined with perfect signal intergrity.
ESD3V3U4ULC terminology preliminary data sheet 17 revision 0.9, 2010-10-14 terminology c l line capacitance dsc digital still camera dvd digital versatile disc dvi digital visual interface eft electrical fast transient esd electrostatic discharge hdmi high definition multimedia interface iec international electrotechnical commission i pp peak pulse current i r reverse current i rwm reverse working current maximum lcd liquid crystal display mp3 moving picture experts group iii pcb printed circuit board r dyn, fwd forward dynamic resistance r dyn, rev reverse dynamic resistance rohs restriction of hazardous substances directive s-ata serial advanced technology attachment stb set-top-box t a ambient temperature tlp transmission line pulse t op operation temperature t p pulse duration t r pulse rise time t stg storage temperature usb universal serial bus v cl reverse clamping voltage v esd electrostatic discharge voltage v fc forward clamping voltage v hold holding voltage v iec equivalent stress level according iec61000-4-2 ( r = 330 ? , c = 150 pf) v r reverse voltage v rwm reverse working voltage maximum v trig triggering voltage z 0 impedance
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